Compare thermal paste and thermal pad

Compare thermal paste and thermal pad | What is best for a laptop

Due to the design fea­tures, lap­tops very often suf­fer from over­heat­ing. All com­po­nents are locat­ed close to each oth­er, and the air inside the case prac­ti­cal­ly does not cir­cu­late — and that is why the tem­per­a­ture of the “iron” ris­es almost expo­nen­tial­ly. Over­heat­ing, in turn, leads not only to a decrease in per­for­mance due to the throt­tling effect, but also to a reduc­tion in the oper­at­ing peri­od of the com­put­er and the risk of fail­ure of some parts.

There­fore, it is very impor­tant to prop­er­ly orga­nize the cool­ing sys­tem in the device. And its qual­i­ty depends not only on the speed of the fans and the clean­li­ness of the radi­a­tors, but also on the ther­mal con­duc­tiv­i­ty of the “con­nect­ing ele­ments” — ther­mal paste and ther­mal pads.

In this arti­cle, we will fig­ure out what is bet­ter for a lap­top — ther­mal paste or ther­mal pad — and also give some tips on orga­niz­ing a cool­ing sys­tem.

thermal paste


thermal paste

One of the most impor­tant con­di­tions for the cor­rect oper­a­tion of the cool­ing sys­tem is that the heat­ing ele­ments should be locat­ed as close as pos­si­ble to the heat pipes or the con­tact plate of the radi­a­tor. But at the same time, it is required that they con­tact through a spe­cial gas­ket, which con­ducts heat.

So, if you attach the con­tact plate of the radi­a­tor to the proces­sor cov­er, air will remain between these two ele­ments. And he, in turn, is an excel­lent heat insu­la­tor. Air will not pass heat from the proces­sor to the heatsink, and the chip will over­heat almost instant­ly.

Ther­mal paste is used to pre­vent this. This emul­sion is based on sil­i­cone or oth­er liq­uid mate­r­i­al inter­spersed with met­al pow­der or micro­crys­tals. The liq­uid com­po­nent of the ther­mal paste is need­ed in order to fill the space between the proces­sor cov­er. And met­al — to con­duct heat from the chip to the radi­a­tor.

When prop­er­ly applied, the thick­ness of the ther­mal paste lay­er is close to zero. Its task, as men­tioned above, is to push air out of the space between the proces­sor and the heatsink, while ensur­ing the trans­fer of high tem­per­a­ture. And, no mat­ter how para­dox­i­cal it may be, the more ther­mal paste is applied, the worse the heat trans­fer. After all, this is a “grease”, and not but­ter on a sand­wich.


It is very impor­tant to note that ther­mal paste is dif­fer­ent. The com­po­si­tion, con­sis­ten­cy and — most impor­tant­ly — ther­mal con­duc­tiv­i­ty dif­fer. The last one is the most impor­tant indi­ca­tor. The high­er the ther­mal con­duc­tiv­i­ty, the bet­ter the ther­mal paste does its job. So, “grease” with a ther­mal con­duc­tiv­i­ty above 10 W / mK can reduce the tem­per­a­ture of the proces­sor by 5–10 degrees com­pared to stock or paste with a val­ue of this indi­ca­tor less than 5 W / mK.

For lap­tops, you should take at least 8 W / mK ther­mal paste. The fact is that the radi­a­tors of mobile com­put­ers are not very pro­duc­tive in them­selves — they are small, unsuc­cess­ful­ly locat­ed and eas­i­ly clogged with dust. There­fore, it is very impor­tant that all oth­er ele­ments of the ther­mal inter­face are of high qual­i­ty.

Of course, the price of such a “paste” can be rel­a­tive­ly high. Do not expect that it will be cheap­er than 10–15 dol­lars. How­ev­er, sav­ing on lap­top cool­ing can result in prob­lems with its fur­ther work.

So, let’s sum up.

Advantages

  • Per­fect­ly copes with the task of dis­si­pat­ing heat — espe­cial­ly mod­els with a high ther­mal con­duc­tiv­i­ty val­ue;

  • A wide range — you can find a ther­mal inter­face at any desired price and with any desired ther­mal con­duc­tiv­i­ty.

Flaws

  • Rel­a­tive­ly high price for real­ly high-qual­i­ty mate­ri­als.

In gen­er­al, ther­mal paste is a clas­sic solu­tion for cool­ing equip­ment. But it is worth remem­ber­ing that by itself it does not reduce the tem­per­a­ture. This is just a con­duc­tor of heat, and spe­cif­ic indi­ca­tors depend on oth­er ele­ments of the cool­ing sys­tem — a cool­er, heat pipes, a radi­a­tor, and even a lap­top case.

thermal pad


thermal pad

As men­tioned above, for effec­tive cool­ing, the thick­ness of the ther­mal paste lay­er should be min­i­mal. Ide­al­ly — 0.1–0.3 mm. But what if the cooled chip itself has a small height, and the con­tact plate of the heatsink sim­ply does not reach it?

In this case, ther­mal pads come to the res­cue. This is the same ther­mal inter­face made of sil­i­cone and met­al dust, only made in the form of a sheet and hav­ing a large thick­ness (in some cas­es up to 1–2 mm). It is he who allows you to “con­nect” the chip and the con­tact plate of the radi­a­tor, act­ing as a con­duc­tor of high tem­per­a­tures.

Due to their large thick­ness, ther­mal pads are less effec­tive than ther­mal paste, but still more effec­tive than air. As a result, they are used to cool low-per­for­mance chips. For exam­ple, “weak” dis­crete video cards or moth­er­board chipsets. But for proces­sors it is bet­ter not to use them. If the man­u­fac­tur­er uses ther­mal pads to remove heat from the “main chip”, this indi­cates, first of all, the lack of a cool­ing sys­tem and the poor build qual­i­ty of the lap­top itself.


It is worth men­tion­ing that some man­u­fac­tur­ers like Gelid or Cool­er Mas­ter pro­duce ther­mal pads with high ther­mal con­duc­tiv­i­ty — from 10 W / mK. How­ev­er, even they, with their liq­uid met­al and ceram­ic dust tech­nolo­gies, can­not over­come the laws of physics. These high per­for­mance ther­mal pads are thin, typ­i­cal­ly 0.5mm thick.

Also, ther­mal pads have one very impor­tant draw­back. Cheap mod­els can be made on a ther­mal­ly unsta­ble sil­i­cone or sim­i­lar base. And under the influ­ence of high tem­per­a­tures, it can leak, there­by dra­mat­i­cal­ly reduc­ing its effec­tive­ness.

When choos­ing a ther­mal pad for a lap­top, the same rule applies as for ther­mal paste: the high­er the ther­mal con­duc­tiv­i­ty, the bet­ter. But it is impor­tant to con­sid­er the loca­tion of this ther­mal inter­face. For exam­ple, in most cas­es, effec­tive cool­ing of the chipset is not nec­es­sary (except for those sit­u­a­tions when a lap­top con­stant­ly “dri­ves” huge data arrays “back and forth” — for exam­ple, a 1C base “spins” on it). So it is not nec­es­sary to choose any ther­mal pads for 10 W / mK — a solu­tion for 5–8 W / mK is enough.

Advantages

  • Ease of place­ment. It is not nec­es­sary to smear the chip with a uni­form thin lay­er, it is enough to cut off a rec­tan­gle of the desired size and stick it in place;

  • Vari­ety of mod­els. There are both thin ther­mal pads and rel­a­tive­ly thick ones — from 0.5 to 5 mm.

Flaws

  • High price. Even the least effi­cient mod­els are com­par­a­tive­ly expen­sive;

  • Rel­a­tive­ly low effi­cien­cy;

  • There is a risk of leak­age.

In gen­er­al, ther­mal pads are more of a nec­es­sary mea­sure. They are used for two pur­pos­es:

  1. If the gap between the con­tact plate of the heatsink and the sur­face of the cooled chip is too large to accom­mo­date a lay­er of ther­mal paste (from 0.3 mm);

  2. If the chip has been scalped and needs to be smoothed out.

Chip scalp­ing is some­times used to improve com­put­er per­for­mance — when over­clock­ing a proces­sor or video card. But it is worth con­sid­er­ing that then he becomes vul­ner­a­ble to out­side influ­ences. Cool­ing the scalped chip is only nec­es­sary with ther­mal pads, which are high­ly like­ly not to leak over the years of use.

Which is better for a laptop — thermal paste or thermal pad


thermal pad

Of course, bet­ter qual­i­ty ther­mal paste with high ther­mal con­duc­tiv­i­ty. But if the gap between the chip and the con­tact plate of the heatsink is too large, then it is rec­om­mend­ed to use a ther­mal pad.

Let’s com­pare these two ther­mal inter­faces.






Char­ac­ter­is­tic




ther­mal paste




ther­mal pad


Appli­ca­tion fea­tures

It is required to place a thin lay­er (0.1–0.3 mm) on a flat and smooth sur­face

It is enough to cut a rec­tan­gle and stick it on the chip. Place­ment on an uneven and rough sur­face is allowed (after scalp­ing, for exam­ple)


Max­i­mum ther­mal con­duc­tiv­i­ty at the time of this writ­ing (accord­ing to the online store)

73 W/mK

12 W/mK


Risks

May dry out, may leak

May leak

Thus, in terms of ease of use, the ther­mal pad wins. But for bet­ter imple­men­ta­tion of cool­ing, it is rec­om­mend­ed to use a cool­er.

In gen­er­al, there is a sim­ple rule. If the man­u­fac­tur­er used a ther­mal pad, then it is bet­ter to install it. If ther­mal paste — then her.

How to organize cooling on a laptop

To avoid over­heat­ing, it is rec­om­mend­ed to fol­low a few sim­ple cool­ing tips:

  1. Use ther­mal inter­faces with high ther­mal con­duc­tiv­i­ty. Rec­om­mend­ed val­ue — from 6 W / mK, on ​​proces­sors and video cards — from 10 W / mK;

  2. Firm­ly press the con­tact soles of the heat pipes to the cooled chips. The stronger, the bet­ter;

  3. Beware of dust on radi­a­tors. At least 1 time in half a year (or 2 times if there are ani­mals in the house) remove the cool­er and care­ful­ly blow through the grate with an air clean­er;

  4. Try to keep lap­tops on flat hard sur­faces. Avoid plac­ing them on fab­ric or knees;

  5. If the space around the key­board is made of met­al, avoid plac­ing stick­ers or oth­er “garbage” on it. This alu­minum pan­el is also used for sys­tem cool­ing;

  6. If the lap­top con­tin­ues to over­heat — for exam­ple, due to pro­longed use under exces­sive loads — then it is bet­ter to pur­chase a cool­ing pad with active cool­ers alto­geth­er.


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